Low-temperature Cu-to-Cu direct bonding enabled by highly (111)- oriented and nanotwinned Cu

Chih Chen*, Jing Ye Juang, Shih Yang Chang, Kai Cheng Shie, Yu Jin Li, King-Ning Tu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this study, a low temperature diffusion bonding enabled by (111) highly oriented nanotwinned Cu (nt-Cu) was proposed. Two different bonding atmospheres, one is in low vacuum bonding, and another is in N bonding were carried out. Both of the two bonding atmospheres show good bonding interfaces after microstructure observation. For vacuum ambient, large-grained structure was found after 250°C for 90 min at 1 MPa in vacuum bonding. The size was as large as 40 μm in width and 10 μm in height. For non-vacuum conditions, the nt-Cu bumps can be bonded to nt-Cu films at the 250°C for 20 min under 40.6 MPa. Accordingly, it is believed that low temperature bonding in low vacuum or non-vacuum ambients can be accomplished by using highly (111)-oriented nt-Cu.

Original languageEnglish
Title of host publication2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages38-38
Number of pages1
ISBN (Electronic)9784904743072
DOIs
StatePublished - May 2019
Event6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
Duration: 21 May 201925 May 2019

Publication series

NameProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
CountryJapan
CityKanazawa, Ishikawa
Period21/05/1925/05/19

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