@inproceedings{c663585d094945a795e27e37e7e20d01,
title = "Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu",
abstract = "In this study, a low temperature solid state diffusion bonding process with (111) highly oriented nano-twined Cu (nt-Cu) was proposed. A less void bonding interface was observed reveals a good bonding quality for the bonded samples. In addition, a large quasi-single grain was identified in the bondedfilm. Based on these results, it is believed that high strength and durable bonding structure can be accomplished by bonding two highly (111)-oriented nt-Cu films.",
author = "Juang, {Jing Ye} and Chu, {Yi Cheng} and Lu, {Chia Ling} and Chih Chen and King-Ning Tu",
year = "2017",
month = jun,
day = "13",
doi = "10.23919/LTB-3D.2017.7947428",
language = "English",
series = "Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017",
address = "United States",
note = "null ; Conference date: 16-05-2017 Through 18-05-2017",
}