Low temperature bonding technology for 3D integration

Cheng Ta Ko, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

87 Scopus citations

Abstract

3D integration provides a promising solution to achieve system level integration with high function density, small form factor, enhanced transmission speed and low power consumption. Stacked bonding is the key technology to enable the communication between different strata of the 3D integration system. Low temperature bonding approaches are explored in industry to solve the performance degradation issue of the integrated devices. In this paper, various low temperature bonding technologies are reviewed and introduced, as well as the latest developments in world-wide companies and research institutes. The outlook for industrial application is also addressed in the paper.

Original languageEnglish
Pages (from-to)302-311
Number of pages10
JournalMicroelectronics Reliability
Volume52
Issue number2
DOIs
StatePublished - 1 Jan 2012

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