Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications

Ruoh Ning Tzeng, Yan Pin Huang, Yu San Chien, Ching Te Chuang, Wei Hwang, Jin-Chern Chiou, Ming Shaw Shy, Teu Hua Lin, Kou Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.

Original languageEnglish
Title of host publicationProceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013
DOIs
StatePublished - 4 Nov 2013
Event2013 16th IEEE International Interconnect Technology Conference, IITC 2013 - Kyoto, Japan
Duration: 13 Jun 201315 Jun 2013

Publication series

NameProceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013

Conference

Conference2013 16th IEEE International Interconnect Technology Conference, IITC 2013
CountryJapan
CityKyoto
Period13/06/1315/06/13

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