Low Dielectric Constant Materials for IC Applications

Jih-Perng Leu, Paul S. Ho, Wei William Lee

Research output: Book/ReportBookpeer-review

Abstract

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
Original languageEnglish
Place of PublicationBerlin Heidelberg
PublisherSpringer Verlag
Number of pages310
ISBN (Electronic)9783642632211
ISBN (Print)9783540678199
StatePublished - 2003

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