Low-dielectric constant FLARE 2.0 films for bottom antireflective coating layers in KrF lithography

H. L. Chen*, H. C. Cheng, M. Y. Li, Fu-Hsiang Ko, T. Y. Huang, T. C. Chu

*Corresponding author for this work

Research output: Contribution to journalArticle

Abstract

In this paper, we demonstrate a new bottom-antireflective coating (BARC) layer for KrF lithography. The antireflective layer is composed of a commercial low-dielectric constant FLARE 2.0-based film. By adding an optimized etching hard-mask layer, reflectance of less than 3% at the resist/silicon substrate interface can be achieved. FLARE 2.0 films also have great potential to be used as BARC layers on highly reflective substrates for metal interconnect applications. It is easy to reduce reflectance without adding an extra BARC layer for patterning low-dielectric materials. It is convenient to use this novel BARC structure in KrF lithography. In this paper, suitable etching characteristics of FLARE 2.0-based BARC layers are also described.

Original languageEnglish
Pages (from-to)1127-1131
Number of pages5
JournalSolid-State Electronics
Volume46
Issue number8
DOIs
StatePublished - 1 Aug 2002

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