Abstract
High-performance Si thin-film transistors (TFTs) on the recessed-channel Si strips with the under-layered nitride film have been fabricated using excimer laser crystallization (ELC). A nitride film was added as a light absorption layer to suppress solidification along the edge of the Si strip. Thus, only one primary grain boundary perpendicular to the Si strip formed in the middle of the recessed region during ELC. The single-crystal-like Si TFTs fabricated on one-half of the recessed region are capable of excellent field-effect mobility of 640 cm 2 /V-s, with only minor deviation.
Original language | English |
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Article number | 7506317 |
Pages (from-to) | 1135-1138 |
Number of pages | 4 |
Journal | IEEE Electron Device Letters |
Volume | 37 |
Issue number | 9 |
DOIs | |
State | Published - 1 Sep 2016 |
Keywords
- Excimer laser crystallization (ELC)
- light absorption layer
- polycrystalline silicon (poly-Si)
- single-crystal-like
- Thin-Film transistor (TFT)