Localized sealing schemes for MEMS packaging

Yu-Ting Cheng*, Y. C. Su, Liwei Lin

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapter

Original languageEnglish
Title of host publicationMems Packaging
PublisherWorld Scientific Publishing Co. Pte Ltd
Number of pages27
ISBN (Electronic)9789813229365
ISBN (Print)9789813229358
StatePublished - 3 Jan 2018

Cite this

Cheng, Y-T., Su, Y. C., & Lin, L. (2018). Localized sealing schemes for MEMS packaging. In Mems Packaging (pp. 223-249). World Scientific Publishing Co. Pte Ltd. https://doi.org/10.1142/9789813229365_0011