Local CDM ESD protection circuits for cross-power domains in 3D IC applications

Shih Hung Chen, Dimitri Linten, Mirko Scholz, Yu Ching Huang, Geert Hellings, Roman Boschke, Ming-Dou Ker, Guido Groeseneken

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

CDM ESD events can be a potential threat to SoC designs or heterogeneous 3D ICs with multiple power domains. Inter-layer (or interface) circuits may need a local CDM ESD clamp that can prevent the unexpected failure under CDM ESD stress. In this letter, two local CDM ESD clamp circuits are proposed. They show better clamping efficiency under 2-ns vfTLP stress.

Original languageEnglish
Article number6807728
Pages (from-to)781-783
Number of pages3
JournalIEEE Transactions on Device and Materials Reliability
Volume14
Issue number2
DOIs
StatePublished - 1 Jan 2014

Keywords

  • 3D stacked ICs
  • charged device model (CDM)
  • cross-power domains ESD events
  • Electrostatic discharge (ESD)
  • vary-fast transmission line pulsing (vfTLP) systems

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