Liquid impingement and phase change for high power density electronic cooling

Avijit Bhunia, Qingjun Cai, Chung Lung Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

10 Scopus citations

Abstract

To cope with the growing power dissipation level of the electronic devices, a phase change liquid jet and spray impingement cooling technique has been developed. The technique has been applied to cool a 1cm × 1cm heat source mimicking an IGBT in an open and closed loop system. In a front side (chip level) cooling approach DI water impinges on a 12.5μm thin dielectric coating layer covering the heat source. A 119-200μm micro-jet array and a 610μm orifice atomizer are used. A high heat flux of 750W/cm2 is reported when the heat source (device) temperature reaches ~175°C. Non-uniformity of the heat source temperature and methods to reduce it are investigated. By controlling the closed loop system pressure to a sub-atmospheric condition and initiating early boiling, the heat source temperature has been reduced up to 60°C, compared to the 1 atmospheric condition, at ~400W/cm2 flux level. A comparative study of the front and backside cooling approaches is presented.

Original languageEnglish
Title of host publication41st Aerospace Sciences Meeting and Exhibit
PublisherAmerican Institute of Aeronautics and Astronautics Inc.
ISBN (Print)9781624100994
DOIs
StatePublished - 2003
Event41st Aerospace Sciences Meeting and Exhibit 2003 - Reno, NV, United States
Duration: 6 Jan 20039 Jan 2003

Publication series

Name41st Aerospace Sciences Meeting and Exhibit

Conference

Conference41st Aerospace Sciences Meeting and Exhibit 2003
CountryUnited States
CityReno, NV
Period6/01/039/01/03

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