Key issues in fabricating microstructures with high aspect ratios by using deep X-ray lithography

Chao Min Cheng*, Ren-Haw Chen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

High aspect ratio microstructures are frequently made with the Lithographie, Galvanoformung, Abformung (LIGA) process. The success of this process depends critically on "deep" X-ray lithography (DXRL). This paper presents a variety of experimentally and analytically determined techniques for optimizing DXRL. These include methods for designing and fabricating high-quality X-ray masks. Methods for optimizing the exposure dosage and developing cycle are described. New methods for promoting resist adhesion and for avoiding resist film cracking are discussed. The influence of developer surface tension on the resist solvation process is quantified and new methods for controlling this surface tension are described.

Original languageEnglish
Pages (from-to)335-342
Number of pages8
JournalMicroelectronic Engineering
Volume71
Issue number3-4
DOIs
StatePublished - 1 May 2004

Keywords

  • DXRL
  • Exposure and development
  • High aspect ratio
  • LIGA
  • Microstructure

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