Joule heating effect under accelerated electromigration in flip-chip solder joints

S. H. Chiu*, S. W. Liang, Chih Chen, D. J. Yao, Y. C. Liu, K. H. Chen, S. H. Lin

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration.

Original languageEnglish
Title of host publicationProceedings - IEEE 56th Electronic Components and Technology Conference
Pages663-666
Number of pages4
DOIs
StatePublished - 22 Dec 2006
EventIEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States
Duration: 30 May 20062 Jun 2006

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2006
ISSN (Print)0569-5503

Conference

ConferenceIEEE 56th Electronic Components and Technology Conference
CountryUnited States
CitySan Diego, CA
Period30/05/062/06/06

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