Job-level computing with BOINC support

Chia Chuan Chang, Ting Han Wei, I-Chen Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Recently, Wu et al. introduced a general approach based on distributed computing named Job-Level (JL) Computing. JL Computing has been successfully used to construct the opening books of game-playing programs.? In order to support large-scale computing problems such as solving 7×7 killall-Go, or building opening books for 9×9 Go or Connect6, record databases are used to store JL computing results. In this paper, we further design a mechanism that combines the JL computing system with BOINC (Berkeley Open Infrastructure for Network Computing), so that we can leverage more computing power from volunteers to solve even larger problems. A preliminary experiment has been done to demonstrate the feasibility of the design.

Original languageEnglish
Title of host publicationTAAI 2016 - 2016 Conference on Technologies and Applications of Artificial Intelligence, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages200-206
Number of pages7
ISBN (Electronic)9781509057320
DOIs
StatePublished - 16 Mar 2017
Event2016 Conference on Technologies and Applications of Artificial Intelligence, TAAI 2016 - Hsinchu, Taiwan
Duration: 25 Nov 201627 Nov 2016

Publication series

NameTAAI 2016 - 2016 Conference on Technologies and Applications of Artificial Intelligence, Proceedings

Conference

Conference2016 Conference on Technologies and Applications of Artificial Intelligence, TAAI 2016
CountryTaiwan
CityHsinchu
Period25/11/1627/11/16

Keywords

  • BOINC
  • Job-Level computing
  • killall-Go
  • volunteer computing

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    Chang, C. C., Wei, T. H., & Wu, I-C. (2017). Job-level computing with BOINC support. In TAAI 2016 - 2016 Conference on Technologies and Applications of Artificial Intelligence, Proceedings (pp. 200-206). [7880173] (TAAI 2016 - 2016 Conference on Technologies and Applications of Artificial Intelligence, Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TAAI.2016.7880173