Irregular Bumps Design Planning for Modern Ball Grid Array Packages

Hsin Yu Chang, Hung Ming Chen, Yun Chih Kuo, Hsien Ting Tsai, Simon Yi Hung Chen, Jyun Ru Jiang, Ya Ying Chien, Yu Yang Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In modern flip-chip packages, bumps are often placed irregularly due to different design needs. It costs a great amount of time and manual effort to generate substrate routing from bumps through vias to package balls. Moreover, any single model in prior works could not be simultaneously applied between bumps, vias and balls. In this work, we propose a unified flow network model to formulate the 2-layer substrate routing problem on irregular package structure. We present a renovated bump model that can handle irregular bump plans, filling the gap/insufficiency in existing models. With our methodology, signal assignment on vias and balls, and substrate routing on two layers can be obtained at the same time. We also present an iterative optimization technique to further improve wire congestion. Our results show that the proposed method completes via and ball assignment efficiently, and obtain 100% routability while improving 16.45% in wirelength, compared with manual design in real industrial cases.

Original languageEnglish
Title of host publicationProceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1838-1843
Number of pages6
ISBN (Electronic)9781728161808
DOIs
StatePublished - Jun 2020
Event70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
Duration: 3 Jun 202030 Jun 2020

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2020-June
ISSN (Print)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
CountryUnited States
CityOrlando
Period3/06/2030/06/20

Keywords

  • ball planning
  • irregular bump
  • irregular package
  • substrate routing

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