Investigations of adhesion between Cu and Benzocyclobutene (BCB) polymer dielectric for 3D integration applications

W. C. Huang, C. T. Ko, S. H. Hu, Leu-Jih Perng, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

In this paper, the adhesion strength between Cu metal and Benzocyclobutene (BCB) polymer dielectric was investigated and reported. The relation between the adhesion strength and thickness of metal layer and the relation between the adhesion strength and stacking order of copper and BCB polymer layer are discussed as well. Finally, the concept of an extra layer between Cu metal and BCB polymer layer to improve the adhesion strength was evaluated. The results of this research can provide important guidelines of hybrid bonding and underfill for 3D integration applications.

Original languageEnglish
Title of host publication2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
Pages363-365
Number of pages3
DOIs
StatePublished - 1 Dec 2011
Event2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011 - Taipei, Taiwan
Duration: 18 Oct 201121 Oct 2011

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
CountryTaiwan
CityTaipei
Period18/10/1121/10/11

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