Investigation of void nucleation and propagation in the joule heating effect during electromigration in flip-chip solder joints

Y. W. Chang, S. H. Chiu, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

This study analyzes the effect of void propagation on the temperature increase of solder joints by using x-ray microscopy, Kelvin probes, and infrared microscopy. It was found that the temperature rise due to void formation was less than 1.3°C when the voids depleted about 75% of the contact opening, even though bump resistance had increased to 10.40 times its initial value. However, the temperature rose abruptly with an increase of up to 8.0°C when the voids depleted 96.2% of the contact opening. A hot spot was observed immediately before the occurrence of open failure in the solder bump. The local increase in temperature was about 30.2°C at the spot. This spot may be the remaining contact area immediately before the occurrence of open failure.

Original languageEnglish
Pages (from-to)2489-2494
Number of pages6
JournalJournal of Electronic Materials
Volume39
Issue number11
DOIs
StatePublished - 1 Nov 2010

Keywords

  • Electromigration
  • Flip-chip solder joints

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