Investigation of the flip-chip package with BCB underfill for W-band applications

Chin Te Wang, Li Han Hsu, Wei Cheng Wu, Heng-Tung Hsu, Edward Yi Chang, Yin Chu Hu, Ching Ting Lee, Szu Ping Tsai

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

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Engineering & Materials Science

Physics & Astronomy