Investigation of RF ladder-type SAW filters incorporating packaging effects

Shuming T. Wang*, I. Kuang Chen, Mei Hui Chung, Chiang Ching Tai, T.m. Choi

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Commercial surface acoustic wave (SAW) device typically is fabricated on piezoelectric substrates and often is required to be integrated into a package before it can be used with other circuits. As operation frequency is increased to gigahertz range, the parasitic effects due to packaging are also increased. Discrepancy in performance, such as passband insertion loss, bandwidth, sideband rejection level, and even center frequency, before and after packaging could be large. Although frequency is a main issue in determining the significance of packaging effects, different design pattern is also an important issue if the device is sensitive to packaging effects. In this paper, the sensitivity to packaging effects of two different RF ladder-type filters was studied, one is a narrow band and high sideband rejection GPS RF filter and the other is a GSM RF filter which is relatively wide band and excellent passband insertion. From the simulation and measurement results, the packaging effects on GPS filter is much more significant than that on GSM filter.

Original languageEnglish
Title of host publication2005 IEEE Ultrasonics Symposium
Pages2178-2181
Number of pages4
DOIs
StatePublished - 1 Dec 2005
Event2005 IEEE Ultrasonics Symposium - Rotterdam, Netherlands
Duration: 18 Sep 200521 Sep 2005

Publication series

NameProceedings - IEEE Ultrasonics Symposium
Volume4
ISSN (Print)1051-0117

Conference

Conference2005 IEEE Ultrasonics Symposium
CountryNetherlands
CityRotterdam
Period18/09/0521/09/05

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    Wang, S. T., Chen, I. K., Chung, M. H., Tai, C. C., & Choi, T. M. (2005). Investigation of RF ladder-type SAW filters incorporating packaging effects. In 2005 IEEE Ultrasonics Symposium (pp. 2178-2181). [1603314] (Proceedings - IEEE Ultrasonics Symposium; Vol. 4). https://doi.org/10.1109/ULTSYM.2005.1603314