Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration

Tzu Chieh Chou, Kai Ming Yang, Jian Chen Li, Ting Yang Yu, Yu Tao Yang, Han Wen Hu, Yu Wei Liu, Cheng Ta Ko, Yu Hua Chen, Tzyy Jang Tseng, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticle

Abstract

With the advantage of high surface-roughness tolerance, the pillar-concave Cu-Cu direct bonding without chemical-mechanical planarization (CMP) is investigated in detail, including the mechanism of thermal compensation, analysis of roughness, bonding strength, and bonding reliability. With the special design of Cu bond structure, excellent bonding results can be achieved under low thermal budget (150 °C for 1 min, atmosphere) with even high roughness of bonding surface. In addition, the pillar-concave scheme applied to fan-out panel-level package (FOPLP) has been demonstrated, showing the high feasibility of this scheme to realize applications in heterogeneous integration.

Original languageEnglish
Article number9125981
Pages (from-to)1296-1303
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume10
Issue number8
DOIs
StatePublished - Aug 2020

Keywords

  • 3-D integration
  • low-temperature bonding

Fingerprint Dive into the research topics of 'Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration'. Together they form a unique fingerprint.

  • Cite this