Investigation of Joule heating effect in various stages of failure in flip-chip solder joints under accelerated electromigration

Hsiang Yao Hsiao; Chih Chen; D. J. Yao

doi:10.1109/IMPACT.2009.5382154

Investigation of Joule heating effect in various stages of failure in flip-chip solder joints under accelerated electromigration

Hsiang Yao Hsiao, Chih Chen, D. J. Yao

Department of Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The Joule heating effect at various stages of electromigration of flip-chip Sn3.5Ag solder joints was investigated under a current of 0.5 Amp at 100°C. During various stages of electromigration, voids may form and propagate and Joule heating effect may vary at different void sizes. To verify the void nucleation and propagation on Joule heating effect during electromigration process, the solder bump was stressed for different lengths of time and then examined by Kelvin bump probes and infrared microscopy. We found that voids started to form at approximately 1.2 times of the initial bump resistance. Then the voids propagated when the bump resistance increased. In addition, the temperature of the solder joints is also increased with the bump resistance and the increase of current stressing time. In the last stage, the temperature of the solder bump increased rapidly due to the bump resistance increased and local Joule heating effect.

Original language	English
Title of host publication	IMPACT Conference 2009 International 3D IC Conference - Proceedings
Pages	162-165
Number of pages	4
DOIs	https://doi.org/10.1109/IMPACT.2009.5382154
State	Published - 1 Dec 2009
Event	IMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan Duration: 21 Oct 2009 → 23 Oct 2009

Publication series

Name	IMPACT Conference 2009 International 3D IC Conference - Proceedings

Conference

Conference	IMPACT Conference 2009 International 3D IC Conference
Country	Taiwan
City	Taipei
Period	21/10/09 → 23/10/09

Access to Document

10.1109/IMPACT.2009.5382154

Link to publication in Scopus

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Hsiao, H. Y., Chen, C., & Yao, D. J. (2009). Investigation of Joule heating effect in various stages of failure in flip-chip solder joints under accelerated electromigration. In IMPACT Conference 2009 International 3D IC Conference - Proceedings (pp. 162-165). [5382154] (IMPACT Conference 2009 International 3D IC Conference - Proceedings). https://doi.org/10.1109/IMPACT.2009.5382154

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title = "Investigation of Joule heating effect in various stages of failure in flip-chip solder joints under accelerated electromigration",

abstract = "The Joule heating effect at various stages of electromigration of flip-chip Sn3.5Ag solder joints was investigated under a current of 0.5 Amp at 100°C. During various stages of electromigration, voids may form and propagate and Joule heating effect may vary at different void sizes. To verify the void nucleation and propagation on Joule heating effect during electromigration process, the solder bump was stressed for different lengths of time and then examined by Kelvin bump probes and infrared microscopy. We found that voids started to form at approximately 1.2 times of the initial bump resistance. Then the voids propagated when the bump resistance increased. In addition, the temperature of the solder joints is also increased with the bump resistance and the increase of current stressing time. In the last stage, the temperature of the solder bump increased rapidly due to the bump resistance increased and local Joule heating effect.",

author = "Hsiao, {Hsiang Yao} and Chih Chen and Yao, {D. J.}",

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Hsiao, HY, Chen, C & Yao, DJ 2009, Investigation of Joule heating effect in various stages of failure in flip-chip solder joints under accelerated electromigration. in IMPACT Conference 2009 International 3D IC Conference - Proceedings., 5382154, IMPACT Conference 2009 International 3D IC Conference - Proceedings, pp. 162-165, IMPACT Conference 2009 International 3D IC Conference, Taipei, Taiwan, 21/10/09. https://doi.org/10.1109/IMPACT.2009.5382154

Investigation of Joule heating effect in various stages of failure in flip-chip solder joints under accelerated electromigration. / Hsiao, Hsiang Yao; Chen, Chih; Yao, D. J.

IMPACT Conference 2009 International 3D IC Conference - Proceedings. 2009. p. 162-165 5382154 (IMPACT Conference 2009 International 3D IC Conference - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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N2 - The Joule heating effect at various stages of electromigration of flip-chip Sn3.5Ag solder joints was investigated under a current of 0.5 Amp at 100°C. During various stages of electromigration, voids may form and propagate and Joule heating effect may vary at different void sizes. To verify the void nucleation and propagation on Joule heating effect during electromigration process, the solder bump was stressed for different lengths of time and then examined by Kelvin bump probes and infrared microscopy. We found that voids started to form at approximately 1.2 times of the initial bump resistance. Then the voids propagated when the bump resistance increased. In addition, the temperature of the solder joints is also increased with the bump resistance and the increase of current stressing time. In the last stage, the temperature of the solder bump increased rapidly due to the bump resistance increased and local Joule heating effect.

AB - The Joule heating effect at various stages of electromigration of flip-chip Sn3.5Ag solder joints was investigated under a current of 0.5 Amp at 100°C. During various stages of electromigration, voids may form and propagate and Joule heating effect may vary at different void sizes. To verify the void nucleation and propagation on Joule heating effect during electromigration process, the solder bump was stressed for different lengths of time and then examined by Kelvin bump probes and infrared microscopy. We found that voids started to form at approximately 1.2 times of the initial bump resistance. Then the voids propagated when the bump resistance increased. In addition, the temperature of the solder joints is also increased with the bump resistance and the increase of current stressing time. In the last stage, the temperature of the solder bump increased rapidly due to the bump resistance increased and local Joule heating effect.

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