Investigation of Joule heating effect in various stages of electromigration in flip-chip solder joints by infrared microscopy

Hsiang Yao Hsiao, Chih Chen*, D. J. Yao

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

The Joule heating effect at various stages under electromigration of flip-chip Sn3.5Ag solder joints was investigated under a current of 0.5 A at 100°C. During various stages of electromigration, voids may form and propagate and Joule heating effect may vary at different void sizes. To verify the void nucleation and propagation on Joule heating effect during electromigration process, the solder bump was stressed for different lengths of time and then examined by Kelvin bump probes and infrared microscopy. We found that voids started to form at approximately 1.2 times of the initial bump resistance. Then the voids propagated when the bump resistance increased. In addition, the temperature of the solder joints increased with the bump resistance and the increase of current stressing time. It increased very slowly in initial stages. In the last stage, the temperature of the solder bump increased rapidly due to the increase of the bump resistance and the local Joule heating effect.

Original languageEnglish
Title of host publication2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
Pages922-925
Number of pages4
DOIs
StatePublished - 9 Aug 2010
Event60th Electronic Components and Technology Conference, ECTC 2010 - Las Vegas, NV, United States
Duration: 1 Jun 20104 Jun 2010

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference60th Electronic Components and Technology Conference, ECTC 2010
CountryUnited States
CityLas Vegas, NV
Period1/06/104/06/10

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