Investigation of Cu/In thermosonic bonding

Yan Pin Huang, Shu Lin Lu, Yu Shang Huang, Yi Hsiu Tseng, Min Fong Shu, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

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Medicine & Life Sciences

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Chemical Compounds

Engineering & Materials Science