Investigation and effects of wafer bow in 3D integration bonding schemes

Kuan-Neng Chen, Y. Zhu, Wen-Wei Wu, R. Reif

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Fingerprint Dive into the research topics of 'Investigation and effects of wafer bow in 3D integration bonding schemes'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy