Investigation and effects of wafer bow in 3D integration bonding schemes

Kuan-Neng Chen, Y. Zhu, Wen-Wei Wu, R. Reif

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

This paper investigates and reviews the effects of wafer bow in three- dimensional (3D) integration bonding schemes, including copper wafer bonding and oxide fusion wafer bonding with silicon on insulator (SOI)-based layer transfer technology. Wafer bow criteria for good bonding quality and fabrication techniques to minimize wafer bow are introduced for 3D integration technology and applications.

Original languageEnglish
Pages (from-to)2605-2610
Number of pages6
JournalJournal of Electronic Materials
Volume39
Issue number12
DOIs
StatePublished - 1 Dec 2010

Keywords

  • 3D integration
  • wafer bonding
  • Wafer bow

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