Introduction to MEMS packaging

Mu Chiao, Yu-Ting Cheng, Liwei Lin

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

4 Scopus citations

Abstract

Scientific and engineering advancements during the past decades in micro and nano devices have brought previously unthinkable applications to reality, such as in space systems, environmental instruments, and daily life appliances. However, a low cost and reliable packaging solution for MEMS/NEMS products remains a very difficult task. This chapter presents the fundamentals of MEMS/NEMS packaging technology, including packaging processes, hermetic and vacuum encapsulations, thermal issues, packaging reliability, and future packaging trends.

Original languageEnglish
Title of host publicationMicrosystems and Nanotechnology
PublisherSpringer-Verlag Berlin Heidelberg
Pages415-446
Number of pages32
Volume9783642182938
ISBN (Electronic)9783642182938
ISBN (Print)3642182925, 9783642182921
DOIs
StatePublished - 1 Aug 2013

Keywords

  • MEMS packaging
  • accelerated testing
  • electronic packagin
  • flip-chip bonding
  • hermetic testing
  • soldering
  • vacuum packaging

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