Introduction to MEMS packaging

Mu Chiao; Yu-Ting Cheng; Liwei Lin

doi:10.1007/978-3-642-18293-8_11

Introduction to MEMS packaging

Mu Chiao, Yu-Ting Cheng, Liwei Lin

Institute of Electronics

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

4 Scopus citations

Abstract

Scientific and engineering advancements during the past decades in micro and nano devices have brought previously unthinkable applications to reality, such as in space systems, environmental instruments, and daily life appliances. However, a low cost and reliable packaging solution for MEMS/NEMS products remains a very difficult task. This chapter presents the fundamentals of MEMS/NEMS packaging technology, including packaging processes, hermetic and vacuum encapsulations, thermal issues, packaging reliability, and future packaging trends.

Original language	English
Title of host publication	Microsystems and Nanotechnology
Publisher	Springer-Verlag Berlin Heidelberg
Pages	415-446
Number of pages	32
Volume	9783642182938
ISBN (Electronic)	9783642182938
ISBN (Print)	3642182925, 9783642182921
DOIs	https://doi.org/10.1007/978-3-642-18293-8_11
State	Published - 1 Aug 2013

Keywords

MEMS packaging
accelerated testing
electronic packagin
flip-chip bonding
hermetic testing
soldering
vacuum packaging

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10.1007/978-3-642-18293-8_11

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