Internal modification for cutting transparent glass using femtosecond Bessel beams

Wu Jung Tsai, Chun Jen Gu, Chung-Wei Cheng, Ji Bin Horng

Research output: Contribution to journalArticlepeer-review

21 Scopus citations


Taking advantage of the nonlinear laser-material interaction, femtosecond lasers can process transparent materials internally on micro- or nanoscales, whose applications include fabrication of micro-optical waveguides and fluidics, as well as stealth dicing of glass, ceramics, and semiconductor materials. A femtosecond Bessel beam has a long invariant transverse intensity profile up to several millimeters with a width of a few microns. Such characteristics allow the materials processing to be completed without moving the beam focusing points as in the case of the Gaussian beam. An experimental femtosecond Bessel beam microprocessing system is built up to investigate the glass internal modification characteristics, such as the width variation and aspect ratios of modification areas. The residual stresses in the irradiated area of glass after modification are also studied using micro Raman spectrum. Finally, an application to thin glass panel cutting is demonstrated by the process of internal modification and breaking. The glass panel is well cut with the chipping on the breaking edge <1 μm.

Original languageEnglish
Article number051503
JournalOptical Engineering
Issue number5
StatePublished - 1 May 2014


  • Bessel beam
  • glass cutting
  • material modification
  • micro Raman stress analysis
  • Subject terms: femtosecond laser

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