Interfacial reactions in thermoelectric modules

Hsin-Jay Wu*, Albert T. Wu, Pai Chun Wei, Sinn Wen Chen

*Corresponding author for this work

Research output: Contribution to journalArticle

4 Scopus citations

Abstract

Engineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the zT values. Nevertheless, modular design holds a key factor to advance the TE technology. Herein, we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi2Te3-based module, soldering is the primary bonding method, giving rise to the investigations on the selections of solder, diffusion barrier layer and electrode. For midtemperature PbTe-based TE module, hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer, electrode and TE substrate are addressed as well. (Figure presented).

Original languageEnglish
Pages (from-to)244-248
Number of pages5
JournalMaterials Research Letters
Volume6
Issue number4
DOIs
StatePublished - 3 Apr 2018

Keywords

  • BiTe
  • Interfacial reaction
  • PbTe
  • Thermoelectric (TE) material and module

Fingerprint Dive into the research topics of 'Interfacial reactions in thermoelectric modules'. Together they form a unique fingerprint.

Cite this