Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples

Sinn wen Chen*, An ren Zi, Po yin Chen, Hsin-Jay Wu, Yu kai Chen, Chao hong Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

29 Scopus citations

Abstract

Sn-Sb and Sn-Sb-based alloys are important high temperature solders. Interfacial reactions are examined in the Sn-5.0 at% Sb/Ag and Sn-10.0 at% Sb/Ag at 200 °C, and Sn-5.0 at% Sb/Cu and Sn-10.0 at% Sb/Cu at 250 °C. Only the Ag3Sn phase is formed in the Sn-Sb/Ag couples, and Cu6Sn5 and Cu3Sn phases are formed in the Sn-Sb/Cu couples. The reaction products all grow linearly with the square root of reaction time which suggests the interfacial reactions are diffusion controlled.

Original languageEnglish
Pages (from-to)17-19
Number of pages3
JournalMaterials Chemistry and Physics
Volume111
Issue number1
DOIs
StatePublished - 15 Sep 2008

Keywords

  • Ag
  • Cu
  • Interfacial reactions
  • Sn-Sb

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