Interfacial reactions in the Sn-In-Zn/Ag and Sn-In-Zn/Ni couples

Sinn Wen Chen*, Ching Feng Yang, Hsin-Jay Wu, Ru Bo Chang, Chia Ming Hsu

*Corresponding author for this work

Research output: Contribution to journalArticle

9 Scopus citations

Abstract

Sn-In-Zn alloys are promising Pb-free solders. Their interfacial reactions with Ag and Ni substrates at 230 °C are experimentally determined using reaction couple techniques. The reaction path is liquid/Ag in the Sn-20 wt%In-x wt%Zn/Ag couple when the Zn content is less than 0.7 wt%, and the reaction path changes to liquid/ε-AgZn3/γ-Ag5Zn 8/-AgZn/Ag when the Zn content is 5 wt%Zn. The reaction path is liquid/Ni3Sn4/Ni when the Zn content is less than 1.0 wt%, and the reaction path becomes liquid/γ-Ni5Zn 21/(Ni3Sn4)/Ni when the Zn content is higher than 2.0 wt%. The reaction paths in both two kinds of couples are affected by the Zn addition.

Original languageEnglish
Pages (from-to)481-487
Number of pages7
JournalMaterials Chemistry and Physics
Volume132
Issue number2-3
DOIs
StatePublished - 15 Feb 2012

Keywords

  • Intermetallic compounds
  • Metals
  • Phase equilibria
  • Phase transitions

Fingerprint Dive into the research topics of 'Interfacial reactions in the Sn-In-Zn/Ag and Sn-In-Zn/Ni couples'. Together they form a unique fingerprint.

Cite this