Interfacial reaction between eutectic Sn-Pb solder and electroplated-Ni as well as electroless-Ni metallization during reflow

Hsiao Yun Chen*, Chih Chen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

Electroplated-Ni (EP-Ni) has been adopted gradually as an underbump metallization layer due to its comparatively lower resistivity and higher deposition rate. In this study, the metallurgical reaction between eutectic Sn-Pb solder and EP-Ni as well as electroless-Ni (EL-Ni) was investigated at 200°C, 210°C, 220°C, and 240°C. It is found that the growth rate of Ni 3Sn 4 intermetallic compound (IMC) on EP-Ni was slower than that on EL-Ni. The consumption rate is measured to be 0.97 × 10 -3 μm/s and 1.48 × 10 -3 μm/s for EP-Ni and EL-Ni, respectively. The activation energy is determined to be 51 kJ/mol and 48 kJ/mol for EP-Ni and EL-Ni, respectively. The dense structure of EP-Ni may be responsible for the lower IMC formation rate.

Original languageEnglish
Pages (from-to)338-344
Number of pages7
JournalJournal of Electronic Materials
Volume38
Issue number2
DOIs
StatePublished - 1 Feb 2009

Keywords

  • Electronic packaging
  • Electroplated Ni
  • Flip-chip solder joints

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