Interfacial reaction at 250°C in the Sn/Ni-7wt.%V couple

Yu Ren Lin*, Kai Wen Pan, Hsin-Jay Wu, Sinn Wen Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Sn is the base element of all the promising electronic solders, and Ni-7wt.%V is the major diffusion barrier layer material of flip chip technology. Interfacial reactions in the Sn/Ni-7wt.%V couple at 250°C are examined in this study. The Ni3Sn4 phase is observed in the Sn matrix. Two phase layers, Sn-Ni-V ternary phase (T phase) and a mixture of the nano-crystalline V 2Sn3 phase and Sn phase (T2 phase), are observed at the Sn/Ni-7wt.%V interface. The microstructures of T phase and T2 phase was analyzed by TEM, T phase has a dense structure and T2 phase has a loose structure. The loose structure of Sn-V phase can not only cause a harmful effect on mechanical properties, but also on electrical properties.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
StatePublished - 1 Dec 2010
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
Duration: 20 Oct 201022 Oct 2010

Publication series

NameInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Conference

Conference2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
CountryTaiwan
CityTaipei
Period20/10/1022/10/10

Keywords

  • Interfacial reactions
  • Ni-7wt.%V
  • Sn
  • Ternary phase
  • VSn

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    Lin, Y. R., Pan, K. W., Wu, H-J., & Chen, S. W. (2010). Interfacial reaction at 250°C in the Sn/Ni-7wt.%V couple. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings [5699617] (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings). https://doi.org/10.1109/IMPACT.2010.5699617