Interfacial morphology and shear deformation of flip chip solder joints

J. W. Jang, C. Y. Liu, P. G. Kim, King-Ning Tu, A. K. Mal, D. R. Frear

Research output: Contribution to journalArticle

29 Scopus citations

Fingerprint Dive into the research topics of 'Interfacial morphology and shear deformation of flip chip solder joints'. Together they form a unique fingerprint.

Physics & Astronomy

Chemical Compounds

Engineering & Materials Science