Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow

A. S. Zuruzi*, C. H. Chiu, W. T. Chen, S. K. Lahiri, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

We carried out experiments and numerical simulations to investigate the transport of Sn in a composite solder joint, comprising of high-Pb and high-Sn (SnPb) alloys, in a chip-composite solder-organic substrate package during the reflow process. Both the experimental and simulation results demonstrate that surface diffusion causes the transport of Sn on the surface to be faster than that inside the solder joint. Surface diffusion also accelerates the homogenization process of the composite solder joint.

Original languageEnglish
Pages (from-to)3635-3637
Number of pages3
JournalApplied Physics Letters
Volume75
Issue number23
DOIs
StatePublished - 6 Dec 1999

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