Interdiffusion of Cu-Sn system with Ni ultra-thin buffer layer and material analysis of IMC growth mechanism

Cheng Han Fan, Yao Jen Chang, Yi Chia Chou, Kuan Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

In this paper, Ni ultra-thin diffusion buffer layer between Cu/Sn is inserted to suppress the IMC (η-phase) inter-diffusion reaction. We analogy the bonding condition by using single side Cu/Ni buffer layer/Sn structure. The inter-diffusion behaviors and IMC growth are investigated under the same thermal budget of bonding temperature during the heating step. Cu/Sn IMC formation behavior with Ni buffer layer is summarized by the SEM inspection. In the results of different Ni buffer layers (tNi = 0, 50, 100, 150 Å) and thermal durations (0 to 60 sec), Ni buffer layer insertion can effectively reduce Cu/Sn IMC thickness. In addition, rapid growth of ∼1.5 μm Cu/Sn IMC thickness at 250 °C for only 10 sec is discovered. As results, 100 Å Ni buffer layer is necessary to apply as the Cu/Sn system enters the submicron pad bonding interconnects.

Original languageEnglish
Title of host publication2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Subtitle of host publicationChallenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages37-40
Number of pages4
ISBN (Electronic)9781479977277
DOIs
StatePublished - 1 Jan 2014
Event9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan
Duration: 22 Oct 201424 Oct 2014

Publication series

Name2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Conference

Conference9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
CountryTaiwan
CityTaipei
Period22/10/1424/10/14

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