Integration of neural sensing microsystem with TSV-embedded dissolvable μ-needles array, biocompatible flexible interposer, and neural recording circuits

Yu Chieh Huang, Yu Chen Hu, Po-Tsang Huang, Shang Lin Wu, Yan Huei You, Jr Ming Chen, Yan Yu Huang, Hsiao Chun Chang, Yen Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Ching-Te Chuang, Jin-Chern Chiou*, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Local brain connectivity is expected to lead to new models for neurological diseases, which may in turn result in advanced understanding and better treatment. This paper presents a neural sensing microsystem integrated with TSV-embedded dissolvable μ-needles array, ENIG bonding technology, biocompatible Au-TSV flexible interposer and neural recording circuits, for neural sensing implantation. An ultra-Thin film bonding approach is proposed for integration of interposer assembly. Removing bonding wire by proposed bonding technology, the dimension of neural sensing system can be minimized to reduce surgical area and promote implant success rate. The signal quality of neural recording can be significantly improved by eliminating complex signal paths with 2.5D TSV integration from neural sensing interface to neural recording circuits.

Original languageEnglish
Title of host publication2016 IEEE Symposium on VLSI Technology, VLSI Technology 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509006373
DOIs
StatePublished - 21 Sep 2016
Event36th IEEE Symposium on VLSI Technology, VLSI Technology 2016 - Honolulu, United States
Duration: 13 Jun 201616 Jun 2016

Publication series

NameDigest of Technical Papers - Symposium on VLSI Technology
Volume2016-September
ISSN (Print)0743-1562

Conference

Conference36th IEEE Symposium on VLSI Technology, VLSI Technology 2016
CountryUnited States
CityHonolulu
Period13/06/1616/06/16

Keywords

  • 2.5D
  • TSV
  • flexible
  • interposer
  • neural sensing

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