Integration, electrical performance, and Reliability Investigation of TSV

S. W. Lee, Y. C. Hu, C. H. Chiang, K. H. Chen, C. T. Chiu, C. T. Chuang, Wei Hwang, Jin-Chern Chiou, H. M. Tong, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Original languageEnglish
Title of host publicationInternational Conference and Exhibition on Device Packaging 2013
Pages172-186
Number of pages15
DOIs
StatePublished - 18 Dec 2013
Event9th International Conference and Exhibition on Device Packaging, DPC 2013 - Scottsdale/Fountain Hills, AZ, United States
Duration: 11 Mar 201314 Mar 2013

Publication series

NameInternational Conference and Exhibition on Device Packaging 2013

Conference

Conference9th International Conference and Exhibition on Device Packaging, DPC 2013
CountryUnited States
CityScottsdale/Fountain Hills, AZ
Period11/03/1314/03/13

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