Integrated microspacecraft avionics architecture using 3D multichip module building blocks

Leon Alkalai*, Wai-Chi  Fang

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

3 Scopus citations

Abstract

Multichip module (MCM) technology is used to develop a highly miniaturized three-dimensional avionics architecture for future low-cost space exploration missions. The architecture maximizes the leverage of commercial high-volume software and hardware solutions by using standard interfaces for both the local bus and the inter-node system bus. This approach improves system reliability at a very low cost.

Original languageEnglish
Pages141-144
Number of pages4
StatePublished - 1 Dec 1996
EventProceedings of the 1996 International Conference on Computer Design, ICCD'96 - Austin, TX, USA
Duration: 7 Oct 19969 Oct 1996

Conference

ConferenceProceedings of the 1996 International Conference on Computer Design, ICCD'96
CityAustin, TX, USA
Period7/10/969/10/96

Fingerprint Dive into the research topics of 'Integrated microspacecraft avionics architecture using 3D multichip module building blocks'. Together they form a unique fingerprint.

Cite this