Integrated microprobe array and CMOS MEMS by TSV technology for bio-signal recording application

Lei Chun Chou*, Shih Wei Lee, Po-Tsang Huang, Chih Wei Chang, Shang Lin Wu, Jin-Chern Chiou, Ching Te Chuang, Wei Hwang, Chung Hsi Wu, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Kuan-Neng Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

Bio-signal probes that provide stable observation with high-quality signals are crucial for understanding how the brain works and how the neural signal transmits. Because bio-signals are weak and noisy, the length of the string connecting the sensor and Complementary Metal-Oxide-Semiconductor (CMOS) circuit significantly impacts biosignal quality. The collected weak signals from the sensor must pass through a series of interconnections and interfaces that introduce noise and lead to bulky packaged systems. This work uses through-silicon via (TSV) technology to connect the μ-probe array bio-sensor and CMOS circuit located on opposite sides of a chip for brain neural sensing applications. With the elimination of wire bonding and the reduction of the soldering, bio-signal quality can be significantly improved.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages512-517
Number of pages6
ISBN (Electronic)9781479924073
DOIs
StatePublished - 11 Sep 2014
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: 27 May 201430 May 2014

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period27/05/1430/05/14

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