Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu

H. Y. Hsiao, C. C. Hu, M. Y. Guo, Chih Chen*, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

15 Scopus citations

Abstract

An effective approach to inhibiting the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu is reported. By depositing a very thin layer of solder on Cu, followed by a 10-min reflow, the scallop-type morphology of interfacial Cu6Sn5 intermetallic compounds (IMC) became flat, and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMC was retarded.

Original languageEnglish
Pages (from-to)907-910
Number of pages4
JournalScripta Materialia
Volume65
Issue number10
DOIs
StatePublished - 1 Nov 2011

Keywords

  • 3D-IC packaging
  • Diffusion
  • Intermetallic compound
  • Soldering

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