Influence of Cu columns on current crowding effect in electromigration in flip-chip solder joints

Y. C. Liang*, W. A. Tsao, Da Jeng Yao, Yi Shao Lai, Chih Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The electromigration in SnAg solder bumps with and without Cu column UBM have been investigated at 2.16×10 4 A/cm 2 at 150°C. Different failure modes were observed for the two types of samples. When the SnAg solder bump with only Ni UBM was stressed by 2.16×10 4 A/cm 2, open failure occurred in the bump that the direction of electron flow was from the chip side to the board side. However, the crack formed along the interface between the IMC Cu 6Sn 5 and the solder on the substrate side in the Sn-3.0Ag-0.5Cu solder bump with Cu column UBM. A three-dimensional simulation of the current density distribution was performed to provide a better understanding of the current crowding behavior in the solder bump. The current crowding effect was found to account for the failure in the chip/substrate side.

Original languageEnglish
Title of host publication2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Pages789-793
Number of pages5
DOIs
StatePublished - 1 Dec 2011
Event2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 - Singapore, Singapore
Duration: 7 Dec 20119 Dec 2011

Publication series

Name2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Conference

Conference2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
CountrySingapore
CitySingapore
Period7/12/119/12/11

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  • Cite this

    Liang, Y. C., Tsao, W. A., Yao, D. J., Lai, Y. S., & Chen, C. (2011). Influence of Cu columns on current crowding effect in electromigration in flip-chip solder joints. In 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 (pp. 789-793). [6184535] (2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011). https://doi.org/10.1109/EPTC.2011.6184535