The use of a Cu/Pt/Ti Schottky contact structure and Cu-based airbridges for high-frequency metamorphic high electron mobility transistor (MHEMT) is successfully developed. The material characteristics of the Cu/Pt/Ti Schottky contact on i-InAlAs were studied. Judging from the results of the X-ray diffraction analysis, Auger electron spectroscopy, and transmission electron microscopy, the Cu/Pt/Ti Schottky contact structure on InAlAs was very stable after annealing at 350°C. However, after 400°C annealing, the reaction of copper with the layers underneath started to occur and formed the Cu 4Ti phase. The Cu-metallized MHEMT using the proposed Cu/Pt/Ti T-gate structure and Cu-based airbridges has a saturated drain current of 673 mA/mm and a maximum transconductance of 750 mS/mm. The gate to drain breakdown voltage measured was 14.5 V at a gate reverse current of -1 mA/mm. The device also demonstrated a cutoff frequency Ft of 90 GHz and a maximum frequency of oscillation Fmax of 165 GHz. An MHEMT with a Au/Pt/Ti gate was fabricated and compared with an MHEMT fabricated with the proposed Cu/Pt/Ti gate. These two kinds of MHEMTs showed similar Ft and F max. These results demonstrate that the Cu/Pt/Ti T-gate and Cu-based airbridges can be used for MHEMT fabrication with excellent electrical characteristics.
|Number of pages||4|
|Journal||Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers|
|Issue number||5 A|
|State||Published - 8 May 2007|
- Copper airbridge
- Copper metallization