In situ transmission electron microscope observations of electromigration in copper lines at room temperature

C. N. Liao*, K. C. Chen, Wen-Wei Wu, L. J. Chen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

31 Scopus citations

Abstract

Atomic-scale electromigration (EM) in unpassivated copper metal lines was directly observed in ultrahigh vacuum at room temperature by transmission electron microscopy. It was found that copper atoms on a (211) crystal plane vanished directionally within half an hour when applying an electric current with a density of 2× 106 A cm2 through the tested Cu line. The EM-induced atomic migration appeared to be anisotropic, and the combination of {111} planes and 〈110〉 directions was suggested to be the easiest electromigration system for crystalline copper. EM-induced mass transport was also found to be responsible for the weakening (111) texture of the Cu lines after electric current stressing.

Original languageEnglish
Article number141903
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Volume87
Issue number14
DOIs
StatePublished - 3 Oct 2005

Fingerprint Dive into the research topics of 'In situ transmission electron microscope observations of electromigration in copper lines at room temperature'. Together they form a unique fingerprint.

Cite this