In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

Kai Chen*, N. Tamura, King-Ning Tu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium Proceedings - Reliability and Properties of Electronic Devices on Flexible Substrates
Pages19-24
Number of pages6
StatePublished - 1 Dec 2008
EventReliability and Properties of Electronic Devices on Flexible Substrates - Boston, MA, United States
Duration: 1 Dec 20085 Dec 2008

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1116
ISSN (Print)0272-9172

Conference

ConferenceReliability and Properties of Electronic Devices on Flexible Substrates
CountryUnited States
CityBoston, MA
Period1/12/085/12/08

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