@inproceedings{740ce3d2318d477eadbe55f0a4a2517d,
title = "In-situ microscopic study of Cu intragranular electromigration",
abstract = "Electromigration (EM) in unpassivated copper lines at room temperature has been investigated in ultra-high vacuum by in-situ transmission electron microscopy (TEM), The electric current induced atomic migration in a (211)-oriemed Cu grain has been successfully recorded in real-lime video. The atomic image of the (211) grain was found to vanish directionally when applying an electric current density of 2 × 106 A/cm2 through the Cu line. The results suggested that the combination of {111} planes and 〈110〉 directions to be the easiest EM path in crystalline copper. By performing selective area diffraction (SAD) analysis on a single Cu grain with (111) crystal orientation, some unusual electron diffraction patterns appeared after passing an electric current through the Cu line. It is believed that the EM-induced Cu twinning may be held responsible for the unique diffraction patterns.",
author = "Chen, {K. C.} and Liao, {C. N.} and Wen-Wei Wu and Chen, {L. J.}",
year = "2005",
month = dec,
day = "1",
doi = "10.1557/PROC-0907-MM13-04",
language = "English",
isbn = "1558998624",
series = "Materials Research Society Symposium Proceedings",
pages = "74--79",
booktitle = "In Situ Electron Microscopy of Materials",
note = "null ; Conference date: 28-11-2005 Through 02-12-2005",
}