In-situ early stage Electromigration study in Al line using synchrotron polychromatic X-ray microdiffraction

Kai Chen*, N. Tamura, King-Ning Tu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Electromigration is a phenomenon that has attracted much attention in the semiconductor industry because of its deleterious effects on electronic devices (such as interconnects) as they become smaller and current density passing through them increases. However, the effect of the electric current on the microstructure of interconnect lines during the very early stage of electromigration is not well documented. In the present report, we used synchrotron radiation based polychromatic X-ray microdiffraction for the in-situ study of the electromigration induced plasticity effects on individual grains of an Al (Cu) interconnect test structure. Dislocation slips which are activated by the electric current stressing are analyzed by the shape change of the diffraction peaks. The study shows polygonization of the grains due to the rearrangement of geometrically necessary dislocations (GND) in the direction of the current. Consequences of these findings are discussed.

Original languageEnglish
Title of host publicationMaterials and Processes for Advanced Interconnects for Microelectronics
Pages182-187
Number of pages6
DOIs
StatePublished - 1 Dec 2008
Event2008 MRS Spring Meeting - San Francisco, CA, United States
Duration: 24 Mar 200828 Mar 2008

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1079
ISSN (Print)0272-9172

Conference

Conference2008 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period24/03/0828/03/08

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    Chen, K., Tamura, N., & Tu, K-N. (2008). In-situ early stage Electromigration study in Al line using synchrotron polychromatic X-ray microdiffraction. In Materials and Processes for Advanced Interconnects for Microelectronics (pp. 182-187). (Materials Research Society Symposium Proceedings; Vol. 1079). https://doi.org/10.1557/PROC-1079-N05-02