Improvements on electrical characteristics of p-channel metal-oxide-semiconductor field effect transistors with HfO2 gate stacks by post deposition N2O plasma treatment

Wen Tai Lu, Chao-Hsin Chien*, Wen Ting Lan, Tsung Chieh Lee, Ming Jui Yang, Shih Wen Shen, Peer Lehnen, Tiao Yuan Huang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations


In this work, we found that employing a post deposition N2O plasma treatment following the deposition of HfO2 film can effectively improve the electrical characteristics of p-type channel metal-oxide-semiconductor field-effect transistors (pMOSFETs) with a HfO 2 gate stack in terms of lower gate leakage current, lower interface state density, superior subthreshold swing, higher normalized transconductance and enhanced driving current even though it had led to a slightly higher equivalent oxide thickness (EOT) value of the HfO2 gate stack by around 0.3 nm. In order to clarify the attributes of the improvements, we used charge pumping (CP) measurement to analyze the densities of interface states and bulk traps in the HfO2 gate stacks. The improvements are then ascribed to the higher interface quality offered by the post deposition N 2O plasma treatment. Moreover, we found that to more accurately estimate the bulk traps from the CP measurement, the leakage should be taken into account especially at low frequencies. Finally, it was found that the levels of the bulk traps and interface states can be reduced by the N 2O plasma treatment, which also helps significantly eliminate the degradation of the gate stack during the subsequent voltage stress.

Original languageEnglish
Pages (from-to)7869-7875
Number of pages7
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Issue number11
StatePublished - 9 Nov 2005


  • Bulk trap
  • Charge pumping
  • HfO
  • Interface states
  • NO
  • Plasma treatment

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