Improvement of thermal stability of Ni silicide by additive metals with specific introduction processes

K. Tsutsui*, K. Nagahiro, T. Shiozawa, P. Ahmet, K. Kakushima, H. Iwai

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A new process to improve thermal stability of Ni silicide, so called PSMD (post silicidation metal doping) in which additive metals were introduced to pre-formed NiSi was proposed. In situ deposition of a thin Hf or Pt layer or. the NiSi layer resulted in improvement of thermal stability evaluated by sheet resistance and morphology in the following RTA process at higher temperatures.

Original languageEnglish
Title of host publicationECS Transactions - 5th International Symposium on ULSI Process Integration
Pages207-213
Number of pages7
Edition6
DOIs
StatePublished - 2007
Event5th International Symposium on ULSI Process Integration - 212th ECS Meeting - Washington, DC, United States
Duration: 7 Oct 200712 Oct 2007

Publication series

NameECS Transactions
Number6
Volume11
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

Conference5th International Symposium on ULSI Process Integration - 212th ECS Meeting
CountryUnited States
CityWashington, DC
Period7/10/0712/10/07

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