Improvement of thermal management of high-power GaN-based light-emitting diodes

Bo Hung Liou, Chih Ming Chen*, Ray-Hua Horng, Yi Chen Chiang, Dong Sing Wuu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

52 Scopus citations

Abstract

The thermal management of high-power light-emitting-diode (LED) devices employing various die-attach materials is analyzed. Three types of die-attach materials are tested, including silver paste, Sn-3 wt.% Ag-0.5 wt.% Cu (SAC305) solder, and SAC305 solder added with a small amount of carbon nanotubes (CNTs). The analysis of thermal management is performed by comparing the temperatures of the LED chips in use and the total thermal resistances of the LED devices obtained respectively from the thermal infrared images and thermal transient analysis. Due to the high thermal conductivity of CNT, the addition of CNTs into the SAC305 solder reduces the total thermal resistance and chip temperature of the LED device, and the thermal management of the LED devices is improved accordingly.

Original languageEnglish
Pages (from-to)861-865
Number of pages5
JournalMicroelectronics Reliability
Volume52
Issue number5
DOIs
StatePublished - 1 May 2012

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