Improved low temperature characteristics of p-channel MOSFETs with Si 1-xGe x raised source and drain

Hsiang Jen Huang*, Kun Ming Chen, Tiao Yuan Huang, Tien-Sheng Chao, Guo Wei Huang, Chao-Hsin Chien, Chun Yen Chang

*Corresponding author for this work

Research output: Contribution to journalArticle

7 Scopus citations

Abstract

P-channel metal-oxide semiconductor field-effect transistors with Si 1-xGe x raised source and drain (RSD) have been fabricated and further studied for low temperature applications. The Si 1-xGe x RSD layer was selectively grown by ANELVA SRE-612 ultra-high vacuum chemical vapor deposition (UHVCVD) system. Compared to devices with conventional Si RSD, improved transconductance and specific contact resistance were obtained, and these improvements become even more dramatic with reducing channel length. Well-behaved short channel characteristics with reduced drain-induced barrier lowering (DIBL) and off-state leakage current are demonstrated on devices with 100 nm Si 1-xGe x RSD, due to the resultant shallow junction and less implantation damage. Moreover, temperature measurements reveal that Si 1-xGe x RSD devices show more dramatic improvement in device performance at low temperature (-50°C) operation, which can be ascribed to the higher temperature sensitivity of the Si 1-xGe x sheet resistance.

Original languageEnglish
Pages (from-to)1627-1632
Number of pages6
JournalIEEE Transactions on Electron Devices
Volume48
Issue number8
DOIs
StatePublished - 1 Aug 2001

Keywords

  • Low temperature measurements
  • PMOSFET
  • Selective epitaxial (SEG)
  • Short channel effect
  • Strained-SiGe
  • Ultra-high vacuum chemical vapor deposition

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