A Temperature Monitoring Interface Circuit for PowerPC systems has been designed, implemented, and tested. This design yields a suitable balance of hardware and software components in the Integrated Thermal Management (ITEM) System. Powerview and Lager tools were used to design this chip in one man-month. This circuit was fabricated in an HP 0.5μm single-poly 3-metal process through MOSIS. Laboratory testing agreed with simulation results in verifying the functionality and performance of this circuit to 50MHz, which is the targeted system speed of the ITEM multi-node computer system.
|Number of pages||4|
|State||Published - 1 Dec 2000|
|Event||43rd Midwest Circuits and Systems Conference (MWSCAS-2000) - Lansing, MI, United States|
Duration: 8 Aug 2000 → 11 Aug 2000
|Conference||43rd Midwest Circuits and Systems Conference (MWSCAS-2000)|
|Period||8/08/00 → 11/08/00|