Implementation of a temperature monitoring interface circuit for PowerPC systems

Her-Ming Chiueh*, John Choma, Jeffrey Draper

*Corresponding author for this work

Research output: Contribution to conferencePaper

5 Scopus citations

Abstract

A Temperature Monitoring Interface Circuit for PowerPC systems has been designed, implemented, and tested. This design yields a suitable balance of hardware and software components in the Integrated Thermal Management (ITEM) System. Powerview and Lager tools were used to design this chip in one man-month. This circuit was fabricated in an HP 0.5μm single-poly 3-metal process through MOSIS. Laboratory testing agreed with simulation results in verifying the functionality and performance of this circuit to 50MHz, which is the targeted system speed of the ITEM multi-node computer system.

Original languageEnglish
Pages98-101
Number of pages4
DOIs
StatePublished - 1 Dec 2000
Event43rd Midwest Circuits and Systems Conference (MWSCAS-2000) - Lansing, MI, United States
Duration: 8 Aug 200011 Aug 2000

Conference

Conference43rd Midwest Circuits and Systems Conference (MWSCAS-2000)
CountryUnited States
CityLansing, MI
Period8/08/0011/08/00

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